Canadian semiconductor technology co-innovation mission to Taiwan – September 3 to 6, 2024

Sector: Semiconductors

Subsectors: Technologies, products and industries relevant to semiconductor production, with focus on:

• Manufacturing: integrated circuit design; process integration; chip-on-wafer-on-substrate (cowos) or co-packaged optics advanced packaging; quantum and artificial intelligence (ai) chips; and novel solutions that can be used by chip manufacturers/foundries, fabless design house, and outsourced semiconductor assembly and test (osat) etc.
• III-V photonics: ai enabling, new generation tele/datacom, and photonic sensors for autonomous vehicles or drones for example.

Open to: Small and medium-sized enterprises

Deadline to apply: June 14, 2024

More information: Consult the detailed request for expression of interest

Related program: Canadian International Innovation Program